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    3PEAT PRESENTSMultipurpose 3D Photonic Integration Platform

    3PEAT PRESENTSHeterogeneous integration of PZT films on TriPleX for polarization insensitive phase shifters and switches with 20 ns response time

    3PEAT PRESENTSHybrid integration engine for seamless integration of PolyBoard and TriPleX sections

    3PEAT PRESENTS3D PICs for large-scale optical switches with 20 ns switching time and for the interrogation and optical beam scanning unit of Laser Doppler Vibrometers

    Welcome to 3PEAT

    3D PIC Technology

    Photonic integration platform based on multilayer PolyBoard and TriPleX technology

    Applications

    Optical switching, remote sensing and ranging

    3PEAT invests on 3D photonic integration platform for a multipurpose platform

    3PEAT is a Research and Innovation Action program, funded by the European Commission under the Horizon2020 programme.

    The goal of the project is the joint development of a new kind of integration platform with low optical loss and high integration density for optical switching and remoting sensing applications. To this end under the direction of the ICCS of the NTU Athens, with the partners Optagon Photonics (Greece), LioniX, Solmates, UTwente (all in the Netherlands), Cordon Electronics (Italy), Mellanox (Israel), Polytec (Germany) as well as the Fraunhofer HHI an international consortium of companies and research institutes has been formed which is able to cover the whole integration chain of a 3D platform for optical switching and remoting sensing modules.

    Start: January 1, 2018

    Duration: 3 years

    Budget: 3.993.285,00 €

    Latest News

    News

    3PEAT Promo Video is now available for streaming!