Welcome to 3PEAT
3D PIC Technology
Photonic integration platform based on multilayer PolyBoard and TriPleX technology
Applications
Optical switching, remote sensing and ranging
3PEAT invests on 3D photonic integration platform for a multipurpose platform
3PEAT is a Research and Innovation Action program, funded by the European Commission under the Horizon2020 programme.
The goal of the project is the joint development of a new kind of integration platform with low optical loss and high integration density for optical switching and remoting sensing applications. To this end under the direction of the ICCS of the NTU Athens, with the partners Optagon Photonics (Greece), LioniX, Solmates, UTwente (all in the Netherlands), Cordon Electronics (Italy), Mellanox (Israel), Polytec (Germany) as well as the Fraunhofer HHI an international consortium of companies and research institutes has been formed which is able to cover the whole integration chain of a 3D platform for optical switching and remoting sensing modules.
Start: January 1, 2018
Duration: 3 years
Budget: 3.993.285,00 €
Latest News
EU-Project 3PEAT brings 3D photonic integration in remote sensing and ranging application
The innovative EU-Horizon-2020 research project 3PEAT started in the beginning of January 2018 in Athens. The goal of the project is the joint development of a new
...3PEAT kick-off meeting in Athens
The innovative EU-Horizon-2020 research project 3PEAT started in the beginning of January 2018 in Athens. The goal of the project is the joint development of a new
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