Welcome to 3PEAT
3D PIC Technology
Photonic integration platform based on multilayer PolyBoard and TriPleX technology
Applications
Optical switching, remote sensing and ranging
3PEAT invests on 3D photonic integration platform for a multipurpose platform
3PEAT is a Research and Innovation Action program, funded by the European Commission under the Horizon2020 programme.
The goal of the project is the joint development of a new kind of integration platform with low optical loss and high integration density for optical switching and remoting sensing applications. To this end under the direction of the ICCS of the NTU Athens, with the partners Optagon Photonics (Greece), LioniX, Solmates, UTwente (all in the Netherlands), Cordon Electronics (Italy), Mellanox (Israel), Polytec (Germany) as well as the Fraunhofer HHI an international consortium of companies and research institutes has been formed which is able to cover the whole integration chain of a 3D platform for optical switching and remoting sensing modules.
Start: January 1, 2018
Duration: 3 years
Budget: 3.993.285,00 €
Latest News
3Peat project partners LioniX International and University of Twente at ECOC2021
LioniX International and the University of Twente will participate at ECOC 2021 presenting the
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Second Harmonic Generation in Polymer Photonic Integrated Circuits
Second harmonic generation is an efficient way to create coherent radiation at wavelengths that are not accessible with standard laser sources. In this work the authors demonstrate second harmonic
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