Under the coordination of the Institute of Communications and Computer Systems (ICCS), an international consortium comprising six companies (Optagon Photonics, LioniX, SolMateS, Cordon Electronics Italia, Mellanox and Polytec) and three research institutes (ICCS, Fraunhofer-HHI and Univ. Twente) aims to cover the whole fabrication of optical switching and remote sensing modules based on a 3D platform.

One of the major objectives of the project is the development of a fully functional 3D photonic integration platform based on the use of multiple waveguiding layers and vertical couplers in Fraunhofer's PolyBoard technology, as a means to disrupt the integration scale and functionality. LioniX will offer its silicon-nitride platform (TriPleX) for the combination with this powerful 3D photonic technology via the development of a methodology for the deposition and processing of multilayer polymers inside etched windows on TriPleX chips.